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1

3D System-on-Chip technologies for More than Moore systems

Peter Ramm, Armin Klumpp, Josef Weber, Maaike M. V. Taklo

Journal:

Microsystem Technologies

Year:

2010

Language:

english

File:

PDF, 479 KB

english, 2010

2

Design, process and characterisation of a high-performance vibration sensor for wireless condition monitoring

Andreas Vogl, Dag T. Wang, Preben Storås, Thor Bakke, Maaike M.V. Taklo, Allan Thomson, Lennart Balgård

Journal:

Sensors and Actuators A: Physical

Year:

2009

Language:

english

File:

PDF, 1004 KB

english, 2009

3

SPIE Proceedings [SPIE MOEMS-MEMS - San Francisco, California (Saturday 23 January 2010)] Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX - Use of conductive adhesive for MEMS interconnection in military fuze applications

Gakkestad, Jakob, Kullberg, Richard C., Ramesham, Rajeshuni, Dalsjo, Per, Kristiansen, Helge, Johannessen, Rolf, Taklo, Maaike M. Visser

Year:

2010

Language:

english

File:

PDF, 4.41 MB

english, 2010

4

Low-temperature plasma activated bonding for a variable optical attenuator

Kari Schjølberg-Henriksen, Sigurd Moe, Maaike M. Visser Taklo, Preben Storås, Jon Herman Ulvensøen

Journal:

Sensors and Actuators A: Physical

Year:

2008

Language:

english

File:

PDF, 936 KB

english, 2008

5

Handbook of Wafer Bonding (RAMM:WAFER BONDING O-BK) || Microelectromechanical Systems

Ramm, Peter, Lu, James Jian-Qiang, Taklo, Maaike M. V.

Year:

2012

Language:

english

File:

PDF, 177 KB

english, 2012

6

Handbook of Wafer Bonding (RAMM:WAFER BONDING O-BK) || Front Matter

Ramm, Peter, Lu, James Jian-Qiang, Taklo, Maaike M. V.

Year:

2012

Language:

english

File:

PDF, 188 KB

english, 2012

7

A 2.5-D Integrated Data Logger for Measuring Extreme Accelerations

Gakkestad, Jakob, Sollund, Tomas, Dalsjo, Per, Tveit, Bjorn, Taklo, Maaike M. Visser, Wright, Daniel Nilsen, Helland, Susanne, Kristiansen, Helge, Johnsen, Christian

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2017

Language:

english

File:

PDF, 2.87 MB

english, 2017

8

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

Bleiker, Simon, Visser Taklo, Maaike, Lietaer, Nicolas, Vogl, Andreas, Bakke, Thor, Niklaus, Frank

Journal:

Year:

2016

Language:

english

File:

PDF, 3.99 MB

english, 2016

9

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Compliant interconnects for reduced cost of a ceramic ball grid array carrier

Taklo, Maaike M. V., Larsson, Andreas, Vardoy, Astrid-Sofie B., Kristiansen, Helge, Hoff, Lars, Waaler, Knut

Year:

2012

Language:

english

File:

PDF, 789 KB

english, 2012

10

[IEEE ESSCIRC 2007 - 33rd European Solid-State Circuits Conference - Sevilla, Spain (2010.09.14-2010.09.16)] 2010 Proceedings of ESSCIRC - 3D Integration technology: Status and application development

Ramm, Peter, Klumpp, Armin, Weber, Josef, Lietaer, Nicolas, Taklo, Maaike, De Raedt, Walter, Fritzsch, Thomas, Couderc, Pascal

Year:

2010

Language:

english

File:

PDF, 1.61 MB

english, 2010

11

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Die shear strength as a function of bond frame geometry — Au-Au thermo-compression bonding

Tollefsen, Torleif Andre, Larsson, Andreas, Taklo, Maaike Margrete Visser, Poppe, Erik, Schjolberg-Henriksen, Kari

Year:

2012

Language:

english

File:

PDF, 1.53 MB

english, 2012

12

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Reliable HT electronic packaging — Optimization of a Au-Sn SLID joint

Tollefsen, Torleif A., Taklo, Maaike M. Visser, Aasmundtveit, Knut E., Larsson, Andreas

Year:

2012

Language:

english

File:

PDF, 1.33 MB

english, 2012

13

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Interconnects and substrates for thermal considerations

Larsson, Andreas, Vardoy, Astrid-Sofie B., Oldervoll, Froydis, Storstrom, Olav, Mielnik, Michal, Dalton, Eric, Mahmood, Kafil, Min, Deokki, Taklo, Maaike M. V.

Year:

2012

Language:

english

File:

PDF, 921 KB

english, 2012

14

[IEEE 2013 International Conference on Optical MEMS and Nanophotonics (OMN) - Kanazawa, Japan (2013.08.18-2013.08.22)] 2013 International Conference on Optical MEMS and Nanophotonics (OMN) - Mirrors and anti-reflective surfaces in single crystal silicon by patterning of the silicon surface

Hadzialic, Sanja, Taklo, Maaike M. Visser

Year:

2013

Language:

english

File:

PDF, 317 KB

english, 2013

15

Wafer-level Au–Au bonding in the 350–450 °C temperature range

Tofteberg, Hannah R, Schjølberg-Henriksen, Kari, Fasting, Eivind J, Moen, Alexander S, Taklo, Maaike M V, Poppe, Erik U, Simensen, Christian J

Journal:

Journal of Micromechanics and Microengineering

Year:

2014

Language:

english

File:

PDF, 850 KB

english, 2014

16

Impact of SiO 2 on Al–Al thermocompression wafer bonding

Malik, Nishant, Schjølberg-Henriksen, Kari, Poppe, Erik U, Taklo, Maaike M V, Finstad, Terje G

Journal:

Journal of Micromechanics and Microengineering

Year:

2015

Language:

english

File:

PDF, 1.82 MB

english, 2015

17

ECS Transactions [ECS 216th ECS Meeting - Vienna, Austria (October 4 - October 9, 2009)] - (Invited) 3D Interconnect Technologies for Advanced MEMS/NEMS Applications

Lietaer, Nicolas, Taklo, Maaike, Schjo̸lberg-Henriksen, Kari, Ramm, P.

Year:

2010

Language:

english

File:

PDF, 655 KB

english, 2010

18

AIP Conference Proceedings [AIP FRONTIERS OF CHARACTERIZATION AND METROLOGY FOR NANOELECTRONICS: 2011 - Grenoble (France) (23–26 May 2011)] - Characterization and Failure Analysis of 3D Integrated Systems using a novel plasma-FIB system

Kwakman, Laurens, Franz, German, Taklo, Maaike Margrete Visser, Klumpp, Armin, Ramm, Peter, Seiler, David G., Diebold, Alain C., McDonald, Robert, Chabli, Amal, Secula, Erik M.

Year:

2011

Language:

english

File:

PDF, 516 KB

english, 2011

19

[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Immobilization of metal coated polymer spheres on Indium pads

Duy, Vinh Cao, Nguyen, Hoang-Vu, Kristiansen, Helge, Taklo, Maaike M. V., Aasmundtveit, Knut E., Hoivik, Nils

Year:

2014

Language:

english

File:

PDF, 1.27 MB

english, 2014

20

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Nanoparticle assembly and sintering towards all-copper flip chip interconnects

Zurcher, Jonas, Yu, Kerry, Schlottig, Gerd, Baum, Mario, Taklo, Maaike M. Visser, Wunderle, Bernhard, Warszynski, Piotr, Brunschwiler, Thomas

Year:

2015

Language:

english

File:

PDF, 1.49 MB

english, 2015

21

[IEEE 2010 IEEE International 3D Systems Integration Conference (3DIC) - Munich, Germany (2010.11.16-2010.11.18)] 2010 IEEE International 3D Systems Integration Conference (3DIC) - TSV development for miniaturized MEMS acceleration switch

Lietaer, Nicolas, Summanwar, Anand, Bakke, Thor, Taklo, Maaike, Dalsjo, Per

Year:

2010

Language:

english

File:

PDF, 293 KB

english, 2010

22

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging

Taklo, Maaike M. V., Vardøy, Astrid-Sofie, De Wolf, Ingrid, Simons, Veerle, van de Wiel, H. J., van der Waal, Adri, Lapadatu, Adriana, Martinsen, Stian, Wunderle, Bernhard

Year:

2013

Language:

english

File:

PDF, 1.39 MB

english, 2013

23

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Thermomechanical reliability of gold stud bump bonding for large volume MEMS devices

Visser Taklo, Maaike M., Wright, Daniel Nilsen, Vardoy, Astrid-Sofie, Attard, Alastair, Hajdarevic, Zlatko, Bulacher, Stephan, Saliba, Mario, Wijgaerts, Jan, Borg, Joshua, Vella, David Oscar

Year:

2015

Language:

english

File:

PDF, 1.35 MB

english, 2015

24

[IEEE 2014 International 3D Systems Integration Conference (3DIC) - Kinsdale, Ireland (2014.12.1-2014.12.3)] 2014 International 3D Systems Integration Conference (3DIC) - Metal coated polymer spheres for compliant fine pitch ball grid arrays

Wright, Daniel Nilsen, Visser Taklo, Maaike M., Vardoy, Astrid-Sofie B., Kristiansen, Helge

Year:

2014

Language:

english

File:

PDF, 2.09 MB

english, 2014

25

[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Numerical investigation of ceramic package/ interposer interconnects using isotropic conductive adhesive

Hamou, R. Faycal, Dalsjo, Per, Dorum, Cato, Helland, Susanne, Kristiansen, Helge, Taklo, Maaike M. Visser, Gakkestad, Jakob

Year:

2015

Language:

english

File:

PDF, 1.22 MB

english, 2015

26

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering

Zurcher, Jonas, Carro, Luca Del, Schlottig, Gerd, Wright, Daniel Nilsen, Vardoy, Astrid-Sofie B., Taklo, Maaike M. Visser, Mills, Tobias, Zschenderlein, Uwe, Wunderle, Bernhard, Brunschwiler, Thomas

Year:

2016

Language:

english

File:

PDF, 2.70 MB

english, 2016

27

Texture of Al films for wafer-level thermocompression bonding

Malik, Nishant, Venkatachalapathy, Vishnukanthan, Dall, Wilhelm, Schjølberg-Henriksen, Kari, Poppe, Erik, Visser Taklo, Maaike M., Finstad, Terje G.

Journal:

Superlattices and Microstructures

Year:

2017

Language:

english

File:

PDF, 10.45 MB

english, 2017

28

[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Reliability of plastic core solder balls in relation to formation of intermetallic compounds

Taklo, Maaike M. Visser, Wright, Daniel Nilsen, Graff, Joachim Seland, Carvalho, Patricia Almeida, Austad, Hanne Opsahl, Dalsjo, Per, Gakkestad, Jakob, Ishida, Hiroya, Johnsen, Christian H.

Year:

2016

Language:

english

File:

PDF, 21.75 MB

english, 2016

29

Handbook of Wafer Bonding (RAMM:WAFER BONDING O-BK) || Glass Frit Wafer Bonding

Ramm, Peter, Lu, James Jian-Qiang, Taklo, Maaike M. V.

Year:

2012

Language:

english

File:

PDF, 353 KB

english, 2012